Get
ready for next-generation computers and smartphones that are up to
1,000 times faster than the systems you use today. Computer maker IBM is
developing "skyscraper" computers using huge sandwiches of silicon
chips by sticking layer after layer of chips covered with tiny
components together.
The
process, for which IBM has roped in glue maker 3M, will make PCs and
smartphones up to 1,000 times faster than the existing ones and are
expected to be available in market by 2013.
The
3M currently makes heat resistant glues, adhesives used in the
aerospace industry and sticky tapes, but the hi-tech glues created for
IBM could actually be the key step towards making the next evolutionary
leap in computing, the Daily Mail reported
No comments:
Post a Comment